Electronic Release Film

Core requirements: high cleanliness (clean room production), anti-static (surface resistance 10^6~10^9Ω)

High temperature resistance: 260°C/10s (matching SMT reflow process)

Thickness tolerance: ±0.002mm (high precision requirements)

Release force stability: error <5% (to protect FPC process yield)

Applications: Flexible Printed Circuit (FPC) process, Optical Film Punching, Electronic Component Packaging.

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Tel: +86-21-67191543

Mobile: +86-13386070190

Email: 892065706@qq.com
Address: Xinghuo Industrial Park, Qingcun Town, Fengxian District, Shanghai, China.

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